DPC Ceramic Substrates
Fine-line ceramic circuit substrates for LED packaging, laser chips, TEC modules, sensors and microelectronics.
- Special line/space down to 0.03 mm
- Al2O3, AlN, Si3N4 and quartz glass
- ENIG, immersion silver, OSP and tin finishes
Custom DPC, DBC & AMB Ceramic Substrates
For Power Electronics and Thermal Management
WellPCB manufactures ceramic circuit boards for SiC/GaN power modules, EV chargers, solar inverters, energy storage systems, LED packaging, TEC modules, automotive sensors and RF/microwave devices.
- 50,000 pcs
- Monthly ceramic capacity
- DPC / DBC / AMB
- Ceramic substrate technologies
- AlN / Al2O3 / Si3N4
- Materials for thermal design
Min line / space
0.03 mm
Ceramic Substrate Product Lines
Choose the right ceramic technology for your thermal load, current density, reliability target and assembly method.
DBC Ceramic Substrates
Copper-bonded ceramic substrates for IGBT modules, inverters, automotive power electronics and industrial power supplies.
- 100-800 um copper thickness options
- Al2O3, AlN and ZTA materials
- Single-sided or double-sided structures
AMB Ceramic Substrates
Reliable Si3N4 and AlN AMB substrates for SiC/GaN power modules, EV chargers, energy storage and renewable energy systems.
- 70-800 um copper thickness
- Min conductor spacing 0.3 mm
- Built for high-reliability power modules
Copper Clad Ceramic Substrates
Copper clad ceramic boards for high thermal conductivity, power electronics, LED modules and industrial heat management designs.
- Copper metallization on ceramic substrates
- Suitable for thermal and high-current designs
- Custom shapes, copper patterns and finishes
Engineering Capabilities for Ceramic Circuit Boards
Turn drawings, Gerber files and thermal requirements into manufacturable ceramic substrates with controlled copper, surface finish and outline tolerance.
Send your material and drawing requirements| Capability | DPC | DBC | AMB |
|---|---|---|---|
| Materials | Al2O3, AlN, Si3N4, quartz glass | Al2O3, AlN, ZTA | Si3N4, AlN |
| Copper thickness | 5-500 um | 100-800 um | 70-800 um |
| Minimum line/space | 0.03 mm special | 0.5 / 0.4 mm | 0.3 mm spacing |
| Surface finish | ENIG, Ag, Au, OSP, Sn | OSP, Ag, ENIG, ENEPIG | OSP, Ag, ENIG, Ni, ENEPIG |
| Typical applications | LED, TEC, laser, sensors | IGBT, inverter, power supply | SiC/GaN, EV, ESS, renewable energy |
Material Keywords Engineers Search For
Ceramic PCB buyers often search by substrate material first, then narrow the project by application, copper thickness, thermal performance and supplier type.
Ceramic PCB Materials
Buyer Intent Keywords
High-Value Long-Tail Search Patterns
WellPCB can support long-tail RFQ searches such as high thermal conductivity AlN PCB EV manufacturer, custom aluminum nitride PCB power module supplier, direct bonded copper DBC substrate IGBT factory and precision DPC ceramic PCB LED prototype.
Built for High-Power, High-Thermal Applications
Ceramic substrates help engineers handle heat, insulation and reliability in compact power electronics systems.
SiC/GaN Power Modules
EV Chargers
Automotive
Solar Inverters
Energy Storage Systems
IGBT Modules
LED Packaging
Medical Devices
Laser Chips
TEC Modules
Automotive Sensors
RF / Microwave Devices
Aerospace
Industrial Control
New Energy
Technical Topics for Ceramic PCB Buyers
These SEO resource topics answer common engineering questions and help buyers compare ceramic PCB materials before sending an RFQ.
What is AlN PCB?
Explain aluminum nitride PCB thermal conductivity, insulation and EV power electronics applications.
AlN PCB vs FR4
Compare heat dissipation, dielectric behavior, cost and reliability for high-power designs.
What is DBC Substrate?
Introduce direct bonded copper ceramic substrates for IGBT, inverter and power module projects.
DPC Ceramic PCB vs FR4
Clarify when fine-line ceramic circuits are better than standard FR4 boards.
Al2O3 PCB vs Si3N4 PCB
Help buyers choose alumina or silicon nitride ceramic substrates by strength and thermal load.
Benefits of AMB Substrate for EV Applications
Show why AMB ceramic substrates are used for SiC/GaN power modules and new energy systems.
OEM/ODM Support with Industrial-Grade Quality Control
WellPCB supports custom ceramic substrate projects from material selection and design review to prototype, batch production and global delivery.
DPC, DBC, AMB manufacturing experience
ISO9001, ISO14001 and IATF16949 related systems
Engineering support for drawings, Gerber and application needs
Serving the United States, Germany, Japan, South Korea, India and Brazil
Request a Ceramic Substrate Quote
Share your drawing, material, copper thickness, application and quantity. WellPCB's ceramic substrate team will review your project and contact you soon.
Verified sales contact
Visit or verify our Shenzhen office
Room 408, Building 4, Maluan Innovation Valley, Biling, Pingshan District, Shenzhen, Guangdong, China.
广东省深圳市坪山区碧岭马峦创谷4栋408
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WellPCB Shenzhen Office